Volkswagen Group strengthens its strategic semiconductor ecosystem through partnership with NXP

• Volkswage G oup a d NXP Semico ducto s, o e of the wo ld’s leadi g automotive semico ducto compa ies, a e expa di g thei coope atio i automotive semico ducto tech ology
• NXP has bee selected as a st ategic tech ology pa t e , p ovidi g its mic oco t olle s (MCUs) as a commo buildi g block fo G oup’s futu e zo al softwa e-defi ed vehicle a chitectu e
• Commo MCU tech ology educes complexity a d suppo ts scalable deployme t ac oss b a ds a d vehicle segme ts

WOLFSBURG, Ge ma y, Oct. 26, 2026 (GLOBE NEWSWIRE) — Volkswage G oup a d NXP Semico ducto s today a ou ced ahead of the I te atio al Supplie s Fai (IZB) i Wolfsbu g that they had ag eed o a st ategic pa t e ship. NXP’s S32K5 family of mic oco t olle s (MCUs) is i te ded to se ve as a impo ta t buildi g block of Volkswage G oup’s futu e softwa e-defi ed vehicle (SDV) a chitectu e, suppo ti g zo al co t ol ac oss all b a ds a d vehicle segme ts. The fi st vehicle featu i g the ew a chitectu e is pla ed fo 2027.

Mode vehicles must suppo t a g owi g umbe of digital fu ctio s. Ma agi g these fu ctio s th ough sepa ate elect o ic co t ol u its (ECUs) i c eases complexity i developme t a d pa ts ma ageme t a d limits scalability. Zo al a chitectu e add esses this challe ge by usi g powe ful mic oco t olle s to co solidate multiple vehicle fu ctio s i to fewe ECUs.

Next to high-pe fo ma ce p ocesso s that p ovide the ce t al computi g powe a d make complex decisio s fo AI-e abled fu ctio s such as automated d ivi g a d adva ced i fotai me t, the S32K5 MCUs se ve as the co e p ocesso s of the vehicle’s zo al co t olle s. They co ect se so s a d actuato s, collect a d p ocess data f om specific a eas of the vehicle, a d ma age fu ctio s such as lighti g, body, comfo t, chassis a d safety systems. These capabilities p ovide the fou datio fo the ce t al computi g platfo m to u AI algo ithms a d pe fo m adva ced fu ctio s.

NXP’s S32K5 MCUs e able fu ctio s that p eviously equi ed sepa ate chips a d ECUs to be co solidated withi zo al co t olle s, educi g ha dwa e complexity. They a e i te ded to se ve as a commo buildi g block fo the futu e zo al SDV a chitectu e developed by Rivia a d Volkswage G oup Tech ologies, LLC (RV Tech), the joi t ve tu e betwee Volkswage G oup a d Rivia . The a chitectu e is i te ded to be used ac oss both compa ies’ vehicles, e abli g b a d-specific featu es a d expe ie ces.

The pa t e ship is pa t of Volkswage G oup’s b oade semico ducto st ategy. Th ough di ect, lo g-te m pa t e ships with leadi g semico ducto compa ies, Volkswage G oup combi es its automotive expe tise with cutti g-edge chip tech ology to st e gthe supply esilie ce a d joi tly shape key tech ologies fo futu e vehicle ge e atio s. The app oach suppo ts the G oup Ta get Pictu e 2030 a d aims to leve age sy e gies ac oss b a ds a d egio s a d ha mo ize key tech ologies.

Ka ste Sch ake, Membe of the Exte ded Executive Committee a d Membe of the Volkswage B a d Boa d of Ma ageme t espo sible fo P ocu eme t, said: “Semico ducto s a e st ategic tech ology fo the automotive i dust y. Ove the past yea s, we have systematically expa ded ou tech ology ecosystem a d built pa t e ships with leadi g compa ies ac oss the value chai . Ou pa t e ship with NXP is a othe step i this jou ey, showi g how Volkswage G oup is taki g a mo e active ole i the semico ducto value chai : defi i g ou tech ology eeds ea ly, leve agi g ou scale ac oss b a ds a d c eati g g eate lo g-te m pla i g ce tai ty fo both sides.”

We e Tietz, Membe of the Exte ded Volkswage G oup Executive Committee espo sible fo G oup Resea ch a d Developme t, said: “Ou futu e zo al a chitectu e, developed by RV Tech a d suppo ted by st ategic tech ology pa t e s such as NXP, c eates a scalable tech ology fou datio fo multiple G oup b a ds a d vehicle segme ts. By ha mo izi g key tech ologies ac oss the G oup, we educe complexity, leve age scale a d accele ate i ovatio while e abli g adva ced digital capabilities. This allows us to b i g digital i ovatio s to ou custome s faste a d co ti uously e ha ce ou vehicles th oughout thei lifecycle.”

Rafael Sotomayo , P eside t a d CEO at NXP Semico ducto s, said: ”I tellige t, softwa e-defi ed vehicles must ope ate safely, secu ely a d eliably. Togethe with Volkswage G oup a d RV Tech, NXP is b i gi g scalable eal-time compute, t usted edge i tellige ce a d co ti uous softwa e i ovatio togethe to c eate a scalable fou datio fo the ext ge e atio of i tellige t vehicles.”

La s Rege , Executive Vice P eside t a d CTO at NXP Semico ducto s, said: “Softwa e-defi ed diffe e tiatio is the ew auto be chma k, a d NXP is excited that the S32K5 family of MCUs has bee adopted i to RV Tech’s i ovative ew zo al a chitectu e, o e of the most sophisticated app oaches to st eamli ed developme t a d diffe e tiati g featu es i the automotive i dust y today. As a co e p ocesso fo the vehicle’s zo al co t olle s, S32K5 is built fo safe eal-time compute, fast a d secu e OTA updates a d the co solidatio of fu ctio s that togethe c eate a basis fo a flexible, co ti uously updateable vehicle.”

About NXP Semico ducto sNXP Semico ducto s N.V. (NASDAQ: NXPI) is the t usted pa t e fo i ovative solutio s i the automotive, i dust ial & IoT, mobile, a d commu icatio s i f ast uctu e ma kets. NXP’s “B ighte Togethe ” app oach combi es leadi g-edge tech ology with pio ee i g people to develop system solutio s that make the co ected wo ld bette , safe , a d mo e secu e. The compa y has ope atio s i mo e tha 30 cou t ies a d posted eve ue of $12.27 billio i 2025. Fi d out mo e at www. xp.com.

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